BMEXBP0400H

Configured for Ethernet and X-bus module interconnection in Modicon X80 PAC architectures, the Schneider Electric BMEXBP0400H (BMEXBP0400H Ruggedized Ethernet Backplane) provides direct physical backplane communication and power distribution for Modicon M580, M340, and X80 modules.

Hardware Specifications

Parameter	Specification
Model	BMEXBP0400H
Brand	Schneider Electric
Origin	France
Weight	0.705 kg
Operating Temp	-25 to 70 deg C
Power Consumption	2.8 W at 24 VDC; 162 mW at 3.3 VDC
Product Type	Ruggedized Ethernet Backplane
Series	Modicon X80
Slot Configuration	4 X-bus and Ethernet slots
Electrical Connection	1 XBE expansion module connector
Current Consumption	118 mA at 24 VDC; 49 mA at 3.3 VDC
Protection Rating	IP20
Mounting Method	4 screws panel mounting, 4 M6 screws plate mounting, or 35 mm DIN rail clips
Compatible Controllers	BMXCPS power supply, BMX processor, BME processor, Modicon X80 I/O modules
Environmental Treatment	Conformal coating
Certifications	CE, UL, CSA, RCM, EAC, Merchant Navy, ATEX Zone 2/22, IECEx Zone 2/22

Profinet / EtherNet-IP Deterministic Backplane and I/O Scaling

The BMEXBP0400H provides a dual X-bus and Ethernet backplane structure for Modicon X80 module integration. The four-slot rack supports processor, power supply, I/O, and application modules through a shared mechanical and electrical mounting interface. The ruggedized construction includes conformal coating and environmental resistance characteristics for installations requiring extended temperature operation and protection against gas, dust, sand, salt, and fungal contamination.

The backplane supports common module deployment between Modicon M580 and M340 platforms, allowing X80 I/O modules to maintain the same physical rack structure during controller modernization projects. Hot swapping is supported for most compatible I/O modules according to module specifications.

Frequently Asked Questions

Q: Can BMEXBP0400H support hot swapping of installed modules?
A: The backplane supports hot swap capability for most Modicon X80 I/O modules. Individual module replacement conditions depend on the installed module type and system configuration.

Q: What power interfaces are provided through the backplane?
A: The backplane distributes module power through the rack interface and has a specified current consumption of 118 mA at 24 VDC and 49 mA at 3.3 VDC.

Q: Which controller platforms are compatible with BMEXBP0400H?
A: BMEXBP0400H is compatible with Modicon M580 and M340 PAC systems, BMX/BME processors, BMXCPS power supplies, and Modicon X80 modules.

Field Installation Guidelines

Install the BMEXBP0400H on a mechanically stable panel or 35 mm symmetrical DIN rail using the specified fixing methods. Verify that the rack mounting surface maintains correct alignment for module insertion and connector engagement.

Maintain separation between Ethernet communication wiring and high-current power conductors to reduce electrical interference. Connect cable shields according to the control cabinet grounding design and applicable EMC installation practices.

Before inserting modules, confirm that the backplane connectors are free from contamination and mechanical damage. Verify power supply compatibility, module positioning, and rack configuration before system energization.

For severe environmental installations, ensure that the conformal-coated backplane remains within the specified operating temperature, humidity, and protection conditions.

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