Siemens and Samsung Foundry Elevate Next-Gen Semiconductor Automation
The global industrial automation landscape relies heavily on cutting-edge silicon to power advanced control systems. Recently, Siemens Digital Industries Software and Samsung Foundry expanded their strategic partnership. Together, they aim to revolutionize electronic design automation (EDA) workflows for the global fabless ecosystem.
By aligning Siemens’ software with Samsung’s manufacturing processes, this collaboration addresses soaring design complexities. Ultimately, it accelerates time-to-market and ensures first-pass silicon success for high-performance automation hardware.
Photonic Integration Powers High-Speed Industrial Automation Data
Photonics Integration Supports High-Speed Data Control
Demand for rapid data transmission and optical interconnects is reshaping modern factory automation architectures. Consequently, the partners are co-developing advanced solutions for photonic integrated circuit (PIC) design.
Using the specialized Siemens Calibre software, engineers can leverage equation-based design rule checking. Moreover, the tool supports curvilinear layout verification and precise pattern matching. As a result, these capabilities significantly enhance the manufacturability of intricate photonic designs used in high-speed networking.
Optimizing 2nm Power Integrity for Next-Generation Edge Processors
Advanced Calibre Verification Secures 2nm Silicon Success
Next-generation PLC and DCS processors require exceptional power efficiency and robustness. To meet this need, Samsung Foundry fully qualified the Siemens Calibre nmPlatform suite for its latest nodes.
Furthermore, Samsung plans to debut the Calibre DesignEnhancer Pge tool specifically for its cutting-edge 2nm process technology. This software automatically optimizes power grids during the layout phase. Therefore, it effectively mitigates critical hardware risks like electromigration and voltage drop before manufacturing begins.
Advanced Yield Analysis Enhances Reliability in Control Systems
Tessent Tools Drive High-Resolution Failure Diagnosis
Industrial control systems demand maximum reliability and zero-defect components. To achieve this, the collaboration introduces Siemens’ Tessent software into Samsung’s advanced-node yield analysis.
Specifically, the engineering teams developed a high-resolution chain diagnosis flow for silicon-level inspection. This automated methodology enables highly precise fault detection during failure analysis. Consequently, it ensures that only the most resilient chips enter the industrial machinery supply chain.
3D Packaging Innovates High-Density Chips for Embedded Automation
Innovator3D Streamlines Advanced 2.5D and 3D Packaging
Modern factory automation hardware requires compact, high-density chip architectures. Thus, Samsung Foundry adopted Siemens’ Innovator3D tools for its proprietary 2.3D Cube-E packaging platform.
These digital tools facilitate early-stage floorplanning and automate layout generation for high-pin-count configurations. Additionally, the software seamless verifies complex 2.5D and 3D integrated circuit structures. This process ensures flawless physical implementation and robust thermal performance.
Qualifying Analog and Mixed-Signal Tools for Automotive and Robotics
Solido Simulation Suite Enhances Robustness at 4nm and 2nm
Analog and mixed-signal circuits bridge the gap between digital logic and physical factory sensors. Siemens successfully certified its Solido Simulation Suite across multiple Samsung Foundry process nodes.
Crucially, this certification includes the rigorous 4nm and 2nm technologies optimized for demanding automotive and robotic applications. The suite delivers comprehensive simulation, precise model validation, and deep reliability analysis to withstand harsh industrial environments.
Digital Implementation Optimizes Performance, Power, and Area Efficiency
Aprisa Software Accelerates Digital Chip Implementation
Efficient digital design implementation directly translates to lower power consumption in field-level automation devices. Samsung certified Siemens’ Aprisa digital layout software for its advanced manufacturing nodes.
Currently, both engineering teams actively optimize the software to maximize performance, power, and area (PPA) efficiency. This ongoing integration helps semiconductor designers deliver highly efficient chips for the next generation of industrial smart sensors.